Qualcomm Multiple Chipsets Use-After-Free Vulnerability (CVE-2022-22071)
Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.
A local attacker, without authentication, can achieve full data confidentiality loss, arbitrary modification of data, complete denial of service or system unavailability. Federal agencies are required to remediate by 2023-12-26 under CISA BOD 22-01.
This is a Use After Free (CWE-416) vulnerability in Qualcomm Multiple Chipsets. Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Exploitation requires local access, low attack complexity, no authentication required, and no user interaction required.
Probably yes if any of these apply:
CISA added this CVE to the Known Exploited Vulnerabilities catalog on 2023-12-05 based on evidence of active exploitation in the wild. Federal agencies required to remediate by 2023-12-26.
Manual remediation steps
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