Qualcomm Multiple Chipsets Use-After-Free Vulnerability (CVE-2023-33063)
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
A local attacker, with a low-privilege account, can achieve full data confidentiality loss, arbitrary modification of data, complete denial of service or system unavailability. Federal agencies are required to remediate by 2023-12-26 under CISA BOD 22-01.
This is a Use After Free (CWE-416) vulnerability in Qualcomm Multiple Chipsets. Memory corruption in DSP Services during a remote call from HLOS to DSP. Exploitation requires local access, low attack complexity, a low-privilege authenticated account, and no user interaction required.
Probably yes if any of these apply:
CISA added this CVE to the Known Exploited Vulnerabilities catalog on 2023-12-05 based on evidence of active exploitation in the wild. Federal agencies required to remediate by 2023-12-26.
Manual remediation steps
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